Resonance Technologies Inc.

 Electronic Assembly Services

Our advanced capabilities include the following:

•     SMT and Through-hole capability
•     20”x14” max board size
•     0201 to 52mm QFP component size range
•     Min lead pitch 12mil
•     BGA, Micro BGA and CPS
•     X-ray BGA alignment inspection
•     Offline Programming
•     Computer Integrated Manufacturing
  
     

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Copyright © 2006 Resonance Technology, Inc.
Last modified: 10/26/06